Terecircuits Corporation

Terecircuits has developed a new formulation of adhesive polymer transfer film with unique physical properties allows 1000’s of chips to be simultaneously transferred from a carrier plate to a circuit substrate. Terecircuits has licensable apparatus patents for a multi-use production tool capable of sub-micron placement accuracy. By combining new formulations of polymers with the submicron accuracy of lithography techniques pioneered in semiconductors, Terecircuits is able to make fast, low-cost micro-assembly possible at scale.